For iPhone 11 Pro Pro Max Middle Frame Reballing Stencil Platform Jig Fixture

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₹ 2,499.00 GST Applicable

Highlights

1. Used to locate and relocate mobile phone PCB BGA parts
2. Re-bombard BGA quickly and easily without any damage, providing a solution for iPhone 11 Pro / Pro Max BGA repositioning and repair
3. Strong magnetic adsorption, simple operation
4. Stencils will not deform under high temperature
5. Fast and convenient soldering

SKU: SPO021709 Category:

Description

1. Used to locate and relocate mobile phone PCB BGA parts
2. Re-bombard BGA quickly and easily without any damage, providing a solution for iPhone 11 Pro / Pro Max BGA repositioning and repair
3. Strong magnetic adsorption, simple operation
4. Stencils will not deform under high temperature
5. Fast and convenient soldering

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