Kaisi A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max XS XR

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    Quick Processing and Fast Shipment
  • Quality First

    We only sell OEM 100% Tested products
  • Easy Returns

    Easy Return policy that lets you shop at ease
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  • How Fast We Deliver?

    All orders are delivered as per estimated time mentioned on order.
  • Which Couriers We use?

    We use Bluedart, Ecom Express, Professional, DHL, Fedex and all premium couriers
  • Payment Methods We Accept

    We accept Debit Card, PaytM, Internet Banking, UPI, Wallets and almost all payment methods

 630.00 GST Applicable

Highlights

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone XS Max / XS / XR.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

SKU: SPO021658 Category:

Description

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone XS Max / XS / XR.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

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