Kaisi A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 11 11 Pro 11 Pro Max

Kaisi A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 11 11 Pro 11 Pro Max

  • Fast Shipping

    Quick Processing and Fast Shipment

  • Quality First

    We only sell OEM 100% Tested products

  • Easy Returns

    Easy Return policy that lets you shop at ease

  • Secure Shopping

    Your data is always protected

  • How Fast We Deliver?

    All orders are delivered as per estimated time mentioned on order.

  • Which Couriers We use?

    We use Bluedart, Ecom Express, Professional, DHL, Fedex and all premium couriers

  • Payment Methods We Accept

    We accept Debit Card, PaytM, Internet Banking, UPI, Wallets and almost all payment methods

₹ 630.00 GST Applicable

Highlights

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

SKU: SPO021655 Category:

Description

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

0.0/5
0 reviews
0
0
0
0
0

There are no reviews yet.

Be the first to review “Kaisi A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 11 11 Pro 11 Pro Max”

This site uses User Verification plugin to reduce spam. See how your comment data is processed.

Related products