Kaisi A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 11 11 Pro 11 Pro Max

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    Quick Processing and Fast Shipment

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    We only sell OEM 100% Tested products

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    Easy Return policy that lets you shop at ease

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  • How Fast We Deliver?

    All orders are delivered as per estimated time mentioned on order.

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    We use Bluedart, Ecom Express, Professional, DHL, Fedex and all premium couriers

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    We accept Debit Card, PaytM, Internet Banking, UPI, Wallets and almost all payment methods

₹ 630.00 GST Applicable

Highlights

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

SKU: SPO021655 Category:

Description

1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.

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