Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 11 Pro

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 11 Pro

  • Fast Shipping

    Quick Processing and Fast Shipment

  • Quality First

    We only sell OEM 100% Tested products

  • Easy Returns

    Easy Return policy that lets you shop at ease

  • Secure Shopping

    Your data is always protected

  • How Fast We Deliver?

    All orders are delivered as per estimated time mentioned on order.

  • Which Couriers We use?

    We use Bluedart, Ecom Express, Professional, DHL, Fedex and all premium couriers

  • Payment Methods We Accept

    We accept Debit Card, PaytM, Internet Banking, UPI, Wallets and almost all payment methods

₹ 2,955.00 GST Applicable

Highlights

1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin

SKU: SPO021653 Category:

Description

1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin

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